Sputter deposition
US12249498B2 · kind B2 · utility
0Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2020 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Dec 6, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sputter deposition apparatus including: a substrate support assembly arranged to support a substrate; a target support assembly arranged to support at least one sputter target for use in a sputter deposition of a target material onto the substrate; a plasma generation arrangement arranged to provide plasma for said sputter deposition; and a cartridge arranged to contain the substrate with deposited target material after said sputter deposition. The cartridge is removable from the sputter deposition apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.