Wafer for electronic components
US12249530B2 · kind B2 · utility
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1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2022 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Nov 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.