Communication device with heat dissipation base
US12249750B2 · kind B2 · utility
0Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2022 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Feb 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20336
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A communication device is provided. The communication device includes a heat dissipation case, a heat conductive member, a heat dissipation base, and a communication module. The heat conductive member is thermally connected to the heat dissipation case, and the heat dissipation base is pivotally connected to the heat conductive member. The heat dissipation base is thermally connected to the heat conductive member and is adapted to be rotated between a first orientation and a second orientation relative to the heat conductive member. The communication module is affixed to the heat dissipation base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.