Optoelectronic component
US12249804B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2020 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Jan 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to an optoelectronic component comprising a housing, an optoelectronic semiconductor chip and an optical element. The housing comprises a lead frame which has two external electrical contact points and two contact portions. The housing also comprises a housing body in which the lead frame is embedded, wherein each contact portion extends laterally out of one of the external electrical contact points in each case to a mounting surface of the housing, and therefore contact surfaces of the contact portions are exposed on the mounting surface. An electrical contact structure of the optical element is electrically conductively connected to the contact surfaces of the contact portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.