Enhanced thermal management in electrical boxes using passive cooling
US12250788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2023 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Nov 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20436
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus cools electronic circuitry. A housing encloses the electronic circuitry and includes a plurality of surfaces, each configured to face an adjacent inner wall of the back box upon the housing being mounted inside the back box. A rear surface faces a rear wall of the inner walls of the back box. A mounting plate is disposed opposite to the rear surface, is in thermal contact with the housing, and faces away from the back box. A touch plate is atop of, and in thermal contact with, the mounting plate. The mounting plate and the touch plate combine to provide a path for conducting heat generated by the electronic circuitry away from the housing and for radiating the heat to ambient air. The mounting plate or the touch plate is made of a higher thermal conductivity material to facilitate conduction of heat away from the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.