Heat pipes of an electronic apparatus and method of manufacturing the same
US12250792B2 · kind B2 · utility
0Cited by
7References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 14, 2022 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Mar 9, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0275
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.