Fluid thermal processing
US12251701B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2018 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Dec 28, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A fluid thermal processing device may include a substrate, a platform projecting from the substrate, a fluid heating element supported by the platform, a temperature sensing element, distinct from the fluid heating element, supported by the platform and an enclosure supported by and cooperating with the substrate to form a fluid chamber about the platform. The fluid chamber forms a volume of uniform thickness conforming to and about the platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.