Patent · US Active

Multilayer structures with enhanced adhesive bonding force and articles comprising the same

US12251909B2 · kind B2 · utility

0Cited by

3References

13Claims

0Family size

Assignees

DOW GLOBAL TECHNOLOGIES LLC · US
Rohm and Haas Company · US

Inventors

Gang Wang · Milpitas, US
Lianjiang Zhao · Shanghai, CN
Jingyi Xu · York, US
Xiaobing Yun · Shanghai, CN
Jianping Pan · San Diego, US
Gaobing Chen · Shanghai, CN
Jianliang Zhu · 余新镇, CN

Key dates

Filing date	Aug 27, 2020
Grant date	Mar 18, 2025
Priority date	—
Expiry date	Jan 9, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB32B2553/00
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Provided are multilayer structures and articles comprising same. The multilayer structure comprises: a biaxially-oriented polyethylene film comprising a skin layer with a matte surface and a core, the core comprising one or more core layers; a sealant film; and an adhesive adhering the sealant film to the matte surface of the skin layer of the biaxially-oriented polyethylene film. The multilayer structure can exhibit an enhanced adhesive bonding force in comparison to other multilayer structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.