Techniques for fabricating and separating flexible microelectronics devices from rigid substrates
US12251921B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2023 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Apr 6, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2264/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminate structure and a method used in the manufacturing of flexible electronics or microelectronic devices are provided. The laminate structure comprises a rigid substrate, a flexible microelectronics structure comprising and a debonding structure provided between the rigid substrate and the flexible microelectronics structure. The debonding structure comprises at least one debonding layer made of a non-metallic inorganic material. The laminate structure comprises first and second peeling surfaces, where at least one of the peeling surfaces corresponding to a surface of the debonding structure or to a surface within the debonding structure. The first and second peeling surfaces are peelable by a debonding force resulting from a mechanical delamination and/or from a pressurized fluid delamination, allowing separating the flexible microelectronic device from the rigid substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.