Curable silicone composition, encapsulant and optical semiconductor device
US12252616B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 16, 2021 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Oct 30, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (R13SiO1/2)f(R22SiO2/2)g(R1SiO3/2)h(SiO4/2)i(XO1/2)j wherein R1 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two R1 are alkenyl groups; R2 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one R2 is an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0≤f<1; 0<g<1; 0≤h<0.9; 0≤i<0.5; and 0<j<0.5; f+g+h+i+j=1.0; h+i>0; and j/(f+g+h+i+j)>0.05 and (D) a curing catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.