Photosensitive resin composition, film prepared from the same, and electronic apparatus including the film
US12252627B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Jun 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/38
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin composition and an electronic apparatus including the same are provided. The photosensitive resin composition includes: a first unit including one or more acryloyl groups, a second unit including one or more epoxy groups, and a third unit including at least one hydrophilic group, wherein a ratio of the equivalent weight of the acryloyl group to the equivalent weight of the epoxy group is 2:1 or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.