Fray resistant structure
US12252814B2 · kind B2 · utility
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15References
17Claims
0Family size
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Key dates
| Filing date | Oct 31, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Feb 2, 2043 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD10B2321/022
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The improved multifilament structure is a low denier, heat treated multifilament structure that provides for advantageous mechanical properties, including fray resistance, low shrinkage, high tensile strength and low elongation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.