Thermal sensor integration for system temperature management
US12253423B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 26, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Aug 24, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K2213/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system includes a memory device and a processing device, operatively coupled to the memory device, to perform operations including receiving, from a thermal sensor group including thermal sensors, hotspot temperature measurements with respect to a hotspot. Each temperature measurement is received from a respective thermal sensor. The operations further include determining, from the temperature measurements, a generalized hotspot temperature measurement for the thermal sensor group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.