System and method for detecting a defect in a specimen
US12253472B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Jul 18, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/24
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure generally relates to a system and a method for detecting a defect in a specimen. More particularly, the present disclosure relates to a lithography exposure system and a method for detecting a dispensing error in a wafer The present disclosure provides a system for detecting a defect in a specimen having a lithography exposure tool including a measurement unit and a stage, the measurement unit is configured to obtain topography data of the specimen placed on the stage by illumination of a surface of the specimen with an optical signal, and a processor configured to generate a statistical data from the topography data and produce a defect notification if the statistical data is outside of a control limit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.