Systems and methods for detecting failure of spring contacts
US12253575B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Sep 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/016
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Systems and methods for monitoring and detecting partial or full mechanical failures of a spring contact configured to provide an electrical connection between two elements. In some examples, a spring contact may be arranged between a first element, such as a window or cover of an operational sensor, and a second element, such as a printed circuit board. The window or cover may have an electrical element with a first electrical contact, and the printed circuit board may be attached to the spring contact via a joint (e.g., solder, weld, adhesive). A processing system may be configured to determine a state of the joint based on vibrations sensed by one or more vibration sensors attached to the second element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.