Systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices
US12253901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2021 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Jul 11, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.