Planarization strategy in nano-sized fabrication
US12254906B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Jun 16, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of planarizing a device having a surface topography with at least one material at a surface of the device is described. The method comprises the steps of depositing a stop layer over at least a portion of the at least one material which substantially retains the surface topography of the device. A sacrificial layer is deposited over at least a portion of the stop layer. A planarization process is performed on the device. The planarization process includes the steps of performing a chemical mechanical polish (CMP) on the top surface of the sacrificial layer. A physical removal step is conducted on the remainder portion of the sacrificial layer to form a planarized surface. A second CMP step and a second physical removal step are conducted, to form a planarized device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.