Nanowire-based interconnects for sub-millimeter wave integrated circuit applications

US12255108B2 · kind B2 · utility

Assignees

• Regents of the University of Minnesota · US
• The University of Texas at Dallas · US

Inventors

• Rhonda R. Franklin · Falcon Heights, US
• Aditya Dave · Minneapolis, US
• Yali Zhang · Tangshan City, CN
• Bethanie Joyce Hills Stadler · Minneapolis, US
• Allison Harpel · Minneapolis, US
• Rashaunda Henderson · Minneapolis, US
• Nikita Mahjabeen · Austin, US

Key dates

• Filing date: Jun 17, 2022
• Grant date: Mar 18, 2025
• Expiry date: May 12, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2221/1078
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A device includes a substrate and at least one electrically conducting portion supported by the substrate, the at least one electrically conducting portion including a signal line and a ground plane electrically isolated from the signal line. The electrically conducting portion includes a layer of a first electrically conducting material and a layer of a metal oxide material including anodic aluminum oxide (AAO) and one or more nanowires (NW) of a second electrically conducting material each formed within a corresponding pore extending through the AAO from a first side of the layer to a second side of the layer of the metal oxide material opposite the first side.