Power semiconductor cooling assembly
US12255121B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Dec 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power switch module includes a semiconductor die and a conductive busbar. The semiconductor die is electrically conductively mounted to the busbar. The module also includes a dielectric coolant fluid and the busbar and the semiconductor die mounted thereto are immersed in the dielectric coolant fluid. The module can be include in a power converter assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.