Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
US12255123B2 · kind B2 · utility
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100References
5Claims
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Key dates
| Filing date | Mar 18, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Sep 22, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2260/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.