Patent · US Active

Thin-film saw device with multilayer waveguide

US12255611B2 · kind B2 · utility

0Cited by

0References

15Claims

0Family size

Assignee

RF360 Singapore Pte. Ltd. · SG

Inventors

Michael SMIRNOW · Munich, DE
Matthias Knapp · Munich, DE

Key dates

Filing date	Mar 30, 2020
Grant date	Mar 18, 2025
Priority date	—
Expiry date	Apr 13, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/02866
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

In at least one embodiment, the SAW device comprises a carrier substrate (1), a piezoelectric thin-film (2) on the carrier substrate, an interdigital electrode structure (3) on the piezoelectric thin-film and a layer stack (4) of waveguide layers. The layer stack is arranged between the carrier substrate and the piezoelectric thin-film. The layer stack comprises a first waveguide layer (41) and second waveguide layer (42), wherein a sound velocity in the first waveguide layer is at least 1.5 times as great as in the second waveguide layer. The device may comprise a temperature compensating layer (5) and a trap rich layer (6) between the layer stack and the carrier substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.