Patent · US Active

Apparatus for cooling electronic circuitry components and photonic components

US12256521B2 · kind B2 · utility

0Cited by

4References

16Claims

0Family size

Assignee

NOKIA TECHNOLOGIES OY · FI

Inventors

Raffaele Luca Amalfi · New Providence, US
Stefano Grillanda · Springfield, US
Ryan Enright · Great Neck, US

Key dates

Filing date	Jul 13, 2022
Grant date	Mar 18, 2025
Priority date	—
Expiry date	Feb 12, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8583
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.