Sensor package structure
US12256573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2023 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Dec 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/334
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encapsulant that surrounds the above components. A sensing region of the sensor chip has a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other. The adhesive rings are disposed on the sensing region, and each of the adhesive rings surrounds one of the sub-regions. Each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space. The encapsulant is formed on the substrate and covers the layout boundary of the sensor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.