Patent · US Active

Additive manufacturing techniques using noble metals and/or copper metal and related methods and compositions

US12257623B2 · kind B2 · utility

0Cited by
9References
25Claims
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Key dates

Filing dateDec 2, 2020
Grant dateMar 25, 2025
Priority date
Expiry dateFeb 11, 2041

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/25
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Methods of additive manufacturing using noble metals and/or copper metal, and binder compositions for use during the additive manufacturing methods, are generally described. In some instances, the methods of additive manufacturing include de-binding (and in some cases sintering steps) that afford metal-based composites, de-bound metal structures, and metal objects containing noble metals (e.g., silver, gold, platinum) and/or copper that have improved properties, such as relatively high densities. In certain aspects, combinations of certain metal powders (e.g., noble metal and/or copper powders) with certain binder compositions may result in improved properties of resulting metal objects produced by the additive manufacturing process, such as relatively low surface roughnesses. The binder compositions described may include a low molecular weight polymer (e.g., including an acrylic acid repeat unit) and, in some cases, a cross-linking agent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.