Work processing apparatus
US12257641B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 16, 2022 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Apr 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32541
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A work processing apparatus performs processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate. The processing head includes a plasma electrode that generates plasma and radiates the plasma to the surface to be processed of the work. In the plasma electrode, an annular or solid cylindrical central electrode provided at a center in a radial direction and an annular outer circumferential electrode provided at an outer side in the radial direction with respect to the central electrode are arranged with an annular slit portion intermediating therebetween at a boundary position thereof, the slit portion is configured as a plasma generation space, and a processing pad is provided at bottom surfaces of the central electrode and the outer circumferential electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.