STL model slicing method and device
US12257781B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | May 1, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An STL model slicing method includes: reading and loading an STL model; obtaining a first slice plane; according to a first set thickness, making the first slice plane be horizontally tangential to an STL model to obtain a first profile curve, which is a profile curve of a tangent plane of the STL model and the first slice plane; determining whether the profile curve contains a physical portion of the STL model; if the profile curve contains the physical portion of the STL model, filling the physical portion with white to obtain a white portion; determining a non-physical portion in the profile curve according to the physical portion; filling the non-physical portion with black to form a mask of the tangent plane; and projecting the mask onto a liquid photosensitive resin by means of a first 3D printer, and then curing the white portion to be a first cured profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.