Dual cure composition
US12258487B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2021 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Apr 9, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J183/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition containing: (a) a polysiloxane resin, wherein the polysiloxane resin contains the following siloxane units: [R3SiO1/2], [(OZ)qSiO(4-q)/2] and at least one of [(OZ)tREPSiO(3-t)/2] and [(OZ)dRREPSiO(2-d)/2]; where: each R is independently in each occurrence selected from hydrocarbyls, REP is an epoxy functional hydrocarbyl group, subscript q is in each occurrence a number selected from a range of 0-3, subscript t is in each occurrence a number selected from a range of 0-2, and subscript d is in each occurrence a number selected from a range of 0-1 provided that the average concentration of OZ groups is at least 15 mole-percent relative to moles of silicon atoms in the polysiloxane resin; (b) a photo acid generator; (c) a moisture cure catalyst; and (d) optionally, an epoxy functional diluent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.