Application of conductive via or trench for intra module EMI shielding
US12261127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2022 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Jan 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.