Terminal and connection method
US12261138B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 15, 2021 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Nov 25, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An object of the present technology is to prevent damage in a bonded portion between a semiconductor chip and a substrate in a semiconductor device in which the semiconductor chip is mounted on the substrate.A terminal is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, and electrically connects the electrode of the element and the electrode of the substrate. The terminal includes a plurality of unit lattices and a coupling portion. The unit lattices included in the terminal are formed by bonding a plurality of beams in a cube shape. The coupling portion included in the terminal couples adjacent unit lattices among the plurality of unit lattices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.