Light-emitting chip and light-emitting substrate
US12261259B2 · kind B2 · utility
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1References
12Claims
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Key dates
| Filing date | Sep 22, 2021 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | May 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.