Systems and methods for sealing and providing wireless power to wearable or implantable devices
US12261451B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2020 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Jul 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R24/62
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
One example device includes a first housing portion defining a first coupling surface; a second housing portion defining a second coupling surface, the first housing portion coupled to the second housing portion to form a housing, the first housing portion and the second housing portion defining an opening, the opening intersecting the first coupling surface and the second coupling surface; a first gasket positioned between the first coupling surface and the second coupling surface, the first gasket providing a first seal between the first housing portion and the second housing portion, a printed circuit board (“PCB”) disposed within the housing and coupled to at least one of the first or second housing portions; an electrical connector electrically coupled to the printed circuit board and positioned within the opening; and a second gasket positioned between the electrical connector and the housing, the second gasket providing a second seal between the electrical connector and the housing, wherein the first gasket is positioned to abut the second gasket and wherein compression of the first gasket between the first and second housing portions provides a third seal between the first …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.