Surface acoustic wave device
US12261587B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2024 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Apr 18, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1457
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An acoustic wave device includes a piezoelectric substrate and an interdigital transducer disposed on the piezoelectric substrate, the interdigital transducer including a center region, first and second edge regions, and first and second gap regions, a temperature compensation layer covering the interdigital transducer, and a floating metal layer buried in the temperature compensation layer or disposed on top of the temperature compensation layer. The floating metal layer includes a plurality of floating metal blocks spaced apart from each other and overlapping at least the first and second edge regions of the interdigital transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.