Heat dissipation structure
US12262507B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2022 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Feb 23, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure is provided. The heat dissipation structure includes a heat dissipation unit and a fixation unit. The fixation unit has a bottom and a wall that jointly define a hollow area. The fixation unit is surroundingly arranged on a periphery of a heating source. The hollow area has a first non-masking area, a second non-masking area, and a masking area. The masking area corresponds to at least one part of the heat dissipation unit, and the first non-masking area and the second non-masking area are respectively arranged on opposite sides of the masking area. The first non-masking area has a first volume, the second non-masking area has a second volume, and a sum of the first volume and the second volume is at least greater than a predetermined volume change of the heat dissipation unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.