Heat pipe for improved thermal performance at cold plate interface
US12262508B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Jun 4, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/06
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.