Two-phase immersion-type heat dissipation device having reinforced fins
US12262511B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2023 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Sep 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/203
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase immersion-type heat dissipation device is provided. The two-phase immersion-type heat dissipation device includes a heat dissipation substrate and a plurality of reinforced fins. The heat dissipation substrate has a first surface and a second surface configured to be in contact with a heating element. The first surface is opposite to the second surface and is arranged away from the heating element. The plurality of reinforced fins are integrally formed on the first surface of the heat dissipation substrate, and a thickness of each of the plurality of reinforced fins is less than 1 mm. According to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.