Systems for dissipating heat from vehicle-based devices having electronic circuitry
US12262512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2022 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | May 19, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60H2001/00614
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are example systems for dissipating heat from vehicle-based data processing components. In an example implementation, a heat dissipation device includes a heat sink, an enclosure configured to receive a device including electronic circuitry, a fan, and a flange extending along a periphery of the enclosure and/or the heat sink. The heat dissipation device is configured for insertion into an aperture of a wall of an interior compartment of a vehicle, such that the flange is positioned against the wall, at least a portion of the enclosure is positioned within the interior compartment of the vehicle, and at least a portion of the heat sink and the fan are positioned along an exterior of the vehicle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.