Module
US12262519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2023 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Oct 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.