Worktable for laser processing
US12263543B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Nov 15, 2021 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Jul 10, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23Q2703/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A worktable for laser processing includes a lower plate, internal blocks, and external blocks. The lower plate includes a first area, a second area surrounding the first area, and a third area surrounding the second area. The internal blocks are disposed on the lower plate in the first area and the external blocks are disposed on the lower plate in the third area. The external blocks surround the internal blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.