Computerized demanufacturing system
US12263547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2023 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Jun 19, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B15/02
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method for automated device disassembly includes, at a computerized demanufacturing system, receiving a target electronic device for disassembly. Using a set of one or more sensors of the computerized demanufacturing system, a set of sensor data is collected that quantifies one or more physical properties of the target electronic device. Based at least in part on the set of sensor data, correspondences are identified between one or more effectors of the computerized demanufacturing system and one or more interactable elements of the target electronic device. The interactable elements are automatically manipulated using the one or more effectors to at least partially disassemble the target electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.