Method for producing laminate of two-dimensional material and laminate
US12263662B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Feb 14, 2020 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Mar 5, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2433/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a laminate including a two-dimensional material and an adhesive sheet having a base material and an adhesive layer whose adhesive force decreases due to ultraviolet rays or heat, in which an adhesive force A at 25° C. of the adhesive layer before the ultraviolet rays or heat applies, to a silicon wafer is 1.0 N/20 mm to 20.0 N/20 mm when the adhesive layer is subjected to 180° peeling at a tensile speed of 300 mm/min, and a surface roughness of an adhesive surface of the adhesive layer after the ultraviolet rays or heat has been applied is 0.01 μm to 8.00 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.