Patent · US Active

High-forming multi-layer aluminum alloy package

US12263890B2 · kind B2 · utility

0Cited by
11References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 15, 2020
Grant dateApr 1, 2025
Priority date
Expiry dateMay 15, 2040

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC22F1/047
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Provided herein are novel, high-forming multi-layer aluminum alloy packages that include a core layer and one or more cladding layers. The alloy packages have excellent bake-hardening properties and are highly recyclable. The packages also display exceptional bendability and elongation properties. Also provided herein are novel aluminum alloy compositions for use as cladding layers. The compositions contain up to 0.6 wt. % Fe and one or more of Mn, Ni, Ti, Co, Nb, Cr, V, Zr, Hf and Ta.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.