Composition for forming silica layer and silica layer
US12264075B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Aug 7, 2020 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Jan 9, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1275
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are a composition for forming a silica layer including a silicon-containing polymer and a solvent, wherein when adding 70 g of the composition for forming the silica layer to a 100 ml container, leaving it at 40° C. for 28 days, and taking 1 ml of gas generated from the composition, 1 ml of the gas includes hydrogen gas (H2), silane gas (SiH4), and ammonia gas (NH3), and the hydrogen gas, silane gas, and ammonia gas satisfy Equation 1: [(hydrogen gas amount (ppm))/(silane gas amount (ppm)+ammonia gas amount (ppm))≥1.5], a silica layer manufactured therefrom, and an electronic device including the silica layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.