Curable composition for inkjet, cured product and flexible printed circuit board
US12264249B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2020 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Nov 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/013
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a curable composition for inkjet, a cured product, and a flexible printed circuit board. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet has excellent flexibility, and has a withstand voltage of greater than 2 kV even when the thickness is less than 20 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.