Methods for electrochemical additive manufacturing while modifying electrolyte solutions
US12264405B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2022 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | May 28, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Described herein are electrochemical additive manufacturing systems and methods of using such systems. In some examples, a method comprises flowing an electrolyte solution into the gap formed by an electrode array and a deposition electrode and depositing (electroplating) a target material onto the deposition electrode. The method also comprises changing one or more characteristics of the electrolyte solution within the system, e.g., to remove deposition byproducts, replenish consumed components, and/or change the solution composition to modify various properties of the deposited target material (e.g., composition, morphology) without major changeovers within the system. These electrolyte changes can be performed dynamically while the system continues to operate. The changed characteristics can be acid concentration, feedstock ion concentration, additive concentration, temperature, and flow rate. In some examples, the solution is flowed into the gap from a supply reservoir and recirculated back into the supply reservoir after exiting the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.