Multilayer electronic component including non-conductive resin layer on body thereof
US12266479B2 · kind B2 · utility
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6References
16Claims
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Assignee
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Key dates
| Filing date | Feb 13, 2024 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Feb 13, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/2325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.