Adhesive tapes for receiving discrete components
US12266558B2 · kind B2 · utility
0Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2020 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Oct 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system includes a vacuum chuck; and a tape. The tape includes a flexible polymer substrate; and an adhesive die catching film disposed on the flexible polymer substrate facing a front surface of the flexible polymer substrate. The tape is held on the vacuum chuck by suction applied to a rear surface of the flexible polymer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.