Electronic substrates having heterogeneous dielectric layers
US12266581B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Oct 30, 2020 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Jul 31, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49816
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic substrate may be formed having at least one dielectric layer that is heterogeneous. The heterogeneous dielectric layer may comprise three separately formed materials that decouple the critical regions within a dielectric layer and allow for the optimization of desired interfacial properties, while minimizing the impact to the bulk requirements of the electronic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.