Substrate bonding method
US12266623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2022 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Sep 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20108
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate bonding method includes: providing a first and a second substrate; forming, on the first substrate, a first metal micro-bump array including first metal pillar(s) formed on the first substrate and first metal nanowires formed thereon and spaced apart from each other; forming, on the second substrate, a second metal micro-bump array including second metal pillar(s) formed on the second substrate and second metal nanowires formed thereon and spaced apart from each other; pressing the first substrate onto the second substrate, such that the first and second metal micro-bump arrays are positioned and staggered with each other, forming a physically interwoven interlocking structure between the first and second metal nanowires; applying a filling material between the first and second substrates; curing the filling material to form a bonding cavity; and then performing confined heating reflux on the first and second metal micro-bump arrays in the bonding cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.