Electronic device
US12266852B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2024 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Jan 11, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/07
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.