Thermal connection between printed circuit board and base plate with epoxy molded material
US12266874B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2022 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Jun 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20854
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A control unit having a connection structure for connecting components of the control unit to a base plate which is cost effective, and facilitates heat transfer from a printed circuit board (PCB) to the base plate. The control unit includes circuitry mounted to a PCB, and the PCB is mounted to a base plate. The circuitry is over molded with epoxy material during manufacturing. The epoxy material flows between the PCB and the base plate, such that a layer of the epoxy is disposed between the PCB and the base plate. This layer of epoxy functions as a heat transfer layer, and a connection structure to connect the PCB to the base plate. The epoxy material transfers heat from the surface of the PCB in contact with the layer of epoxy to the surface of the base plate in contact with the layer of epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.